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A股東山精密據報最快下月香港上市 集資最多234億元

Future Wealths
Future Wealths
29 9 月, 2026
One Min Read
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彭博社引述知情人士報道，A股上市的印刷電路板（PCB）製造巨企東山精密（深：002384）最快可能於下個月在香港掛牌，目標集資規模約20億至30億美元（約156億至234億港元）。相關討論仍在進行中，公司代表暫未就上市傳聞置評。

原文: https://finance.mingpao.com/fin/instantf/20260929/1790679187535/a%E8%82%A1%E6%9D%B1%E5%B1%B1%E7%B2%BE%E5%AF%86%E6%93%9A%E5%A0%B1%E6%9C%80%E5%BF%AB%E4%B8%8B%E6%9C%88%E9%A6%99%E6%B8%AF%E4%B8%8A%E5%B8%82-%E9%9B%86%E8%B3%87%E6%9C%80%E5%A4%9A234%E5%84%84%E5%85%83%22%20target=%22blank

Last Update: 29 9 月, 2026

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